The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 1989
Filed:
Oct. 31, 1988
Kenneth Brown, Alto Loma, CA (US);
Hamilton Standard Controls, Inc., Farmington, CT (US);
Abstract
A method is described for providing electrically resistive elements for mounting in an electrical resistor device for engagement with a relatively movable contact member, as in a potentiometer. A pair of termination openings are formed through a substrate of insulating material such as plastic film. A release liner is applied to the undersurface of the substrate to cover the openings. An electrically conductive medium is applied in fluid (paste) form to the top surface of the substrate and is caused to fill the termination openings, as by applying pressure. The conductive medium is solidified and the release liner is removed. A resistive medium for ultimate engagement with the movable contact is applied to the top surface of the substrate in engagement with the termination openings. The resistive track is shaped as desired, either linear or an annular segment, preferably as part of final shaping steps which also remove the resistive element from a continuous strip of the substrate material. The resultant shape of the resistive track includes the conductor-filled termination openings under opposite ends thereof. The resistive element may then be affixed to a more rigid substrate, with its pair of termination openings in alignment and conductivity joined to a respective pair of termination pads on the more rigid substrate.