The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 1989
Filed:
Sep. 18, 1986
Casio Computer Co., Ltd., Tokyo, JP;
Abstract
An IC including an EEP-ROM is formed on a semiconductor wafer. The IC also has exposed address pads connected to the address bus of the EEP-ROM, and exposed data pads connected to the data bus of the EEP-ROM. A test probe is brought into contact with these pads, thereby performing various tests on the IC. After the IC has been tested, the wafer is diced into IC pellets. The address pads are disconnected from the address bus and/or the data pads are disconnected from the data bus. For example, the edge portions of the IC pellet on which the address pads and/or the data pads are formed are cut by dicing from the remaining portion of the IC pellet. Thereafter, the connecting pads of the IC pellet are wire-bonded to leads, and the IC pellet is sealed with a resin. Finally, the sealed IC pellet is built in an IC card body.