The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 1989
Filed:
Sep. 28, 1987
Applicant:
Inventors:
Hiroshi Hotta, Fuji, JP;
Yoshiharu Suzuki, Fuji, JP;
Assignee:
Polyplastics Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; C23C / ;
U.S. Cl.
CPC ...
264129 ; 2041921 ; 427124 ; 427250 ;
Abstract
A surface metallizing method for application in producing a metallized polybutylene terephthalate part is conducted by using a molded part consisting chiefly of a polybutylene terephthalate resin composition containing 2-40% by weight of potassium-titanate fiber relative to the total weight of the composition, and subjecting the molded part to sputtering or vacuum metallizing, thereby forming a metallized coat thereon.
Hotta, Hiroshi. (1989). Surface metallizing method (U.S. Patent No. 4844851). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4844851
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile