The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 1989
Filed:
Feb. 03, 1988
Yoshio Nakatani, Toyonaka, JP;
Tooru Tamura, Ikeda, JP;
Mikio Nozu, Yamatokouriyama, JP;
Takahiro Manabe, Katano, JP;
Matsushita Electric Industrial Co. Ltd., Osaka, JP;
Abstract
An electronic circuit module comprises a case, first and second substrates disposed in the case on opposite inner walls with a gap therebetween and, a flexible film having a circuit pattern thereon and attached at a part to the first substrate and attached at another part to the second substrate. A first group of electronic components including a heat-generating component are mounted on the film part attached to the first substrate. A second group of electronic components including a low-heat-resistive component are mounted on the film part attached to the second substrate. The gap between the first and second substrates is filled with a resin layer, preferably a foam resin layer, having a low heat conductivity so as to prevent a heat transfer from the heat-generating part to the low-heat-resistive part.