The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 1989

Filed:

Nov. 25, 1986
Applicant:
Inventors:

Yukihiro Kato, Kariya, JP;

Hiroshi Okada, Hekinan, JP;

Yoshifumi Watanabe, Anjo, JP;

Osamu Ina, Anjo, JP;

Osamu Ito, Kariya, JP;

Iwao Yokomori, Kariya, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 79 ; 357 74 ; 357 80 ;
Abstract

A semiconductor pressure transducer comprises a metal housing having a cylindrical recess to which an inlet passage of a medium to be measured is opened, a glass base being received in the recess and having a large diameter cylindrical portion and a small diameter cylindrical portion integrally connected to the large diameter cylindrical portion, a rubber O-ring interposed between a bottom of the recess and the base, a metal tubular collar disposed in the recess around the base to come into contact with the bottom of the recess, the collar urged by a caulked portion of the housing to press the base, a sensor chip provided on an end of the small diameter cylinder of the base for generating an electric signal in response to pressure of said medium, an annular clearance provided between the collar and the base, and an introducing passage provided in the base for introducing the medium from the inlet passage to the sensor chip.


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