The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 1989

Filed:

Nov. 27, 1985
Applicant:
Inventor:

Hermann B Sequeira, Baltimore, MD (US);

Assignee:

Martin Marietta Corporation, Bethesda, MD (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
333 34 ; 333248 ; 333250 ;
Abstract

A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide frequency band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces. This invention is directed to transitions and power couplers implemented in such a multi-layer dielectric slab structure.


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