The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 1989

Filed:

Jan. 19, 1988
Applicant:
Inventors:

Yasuhiro Shindo, Fukui, JP;

Yukio Tsujimoto, Fukui, JP;

Isami Saito, Fukui, JP;

Isamu Hiraoka, Akigawa, JP;

Hiroshi Hirayama, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C21D / ;
U.S. Cl.
CPC ...
148 206 ; 75 / ; 75 / ; 75 / ; 148127 ; 437188 ; 437202 ;
Abstract

Disclosed is a method of heat treatment of a low melting-point metal for production of spheroidal bodies formed of a low melting-point metal or alloy or heat treatment of the low-melting point metal coated on the surface of an electrode of a chip part. The method comprises the steps of placing a high boiling-point liquid, such as oil, into a tubular container disposed vertically and provided with a heater at an upper portion thereof, the high boiling-point liquid being provided with a temperature gradient ranging from a high temperature above the melting point of the metal to be subjected to heat treatment to a low temperature below the melting point thereof; and allowing the low melting-point metal or a low melting-point alloy per se or a material having the low melting-point metal or alloy on its surface to move from the high-temperature portion of the high boiling-point liquid; whereby the low melting-point metal or a low melting-point alloy per se or a material having the low melting-point metal or alloy on its surface is made to melt in the high-temperature portion and is cooled in the low-temperature portion, thereby allowing a melt or a molten portion to solidify.


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