Apparatus and method for plasma treating of circuit boards

Abstract

An apparatus and method for improved plasma treating of circuit boards is disclosed wherein a plasma treating zone and a gas resupply zone are established in a chamber, an actuating mechanism being provided to establish relative movement between the circuit boards and the zones during treatment of the circuit boards. The apparatus preferably includes a chamber for receipt of a gas and having electrodes centrally positioned therein for generating an electrical field at a central portion of the chamber thereby exciting the gas thereat and creating a zone of intense plasma. A transport mechanism is provided in the chamber for moving the circuit boards alternately into and out of the central portion of the chamber for preselected periods of time thus alternately exposing the circuit boards to the intense plasma and to substantially fresh gas outside of the central portion of the chamber thereby providing more uniform plasma treatment of the surface areas of the circuit boards and improved cleaning and etching of openings through the circuit boards which receive a fresh supply of gas therein when the circuit boards are outside of the central portion of the chamber. Using appropriate electrodes the same apparatus may be employed for deposition of metallic layers on the boards in a substantially continuous operation after plasma treating thereof.