The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 1989

Filed:

Sep. 26, 1988
Applicant:
Inventors:

Shosin Fukui, Toyonaka, JP;

Masayoshi Shinjo, Settsu, JP;

Hirokazu Aoyama, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B / ;
U.S. Cl.
CPC ...
106 3822 ; 264130 ; 264264 ; 264300 ; 264338 ;
Abstract

A process for imparting releasing property to a mold which comprises applying to the mold a composition comprising:


Find Patent Forward Citations

Fukui, Shosin. (1989). Mold release composition (U.S. Patent No. 4840675). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4840675

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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