The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 1989

Filed:

Jun. 14, 1988
Applicant:
Inventors:

Wolfgang E Schnitker, Krefeld, DE;

Michael P Nover, Essen, DE;

Kay Appel, Monchen-Gladbach, DE;

Assignee:

U.S. Philips Corporation, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361402 ; 174 685 ; 235492 ; 361406 ;
Abstract

The invention relates to a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths (5), resistors, capacitors and components, in particular integrated switching circuits without a housing, formed according to thick-film technique. This structure has between the electrically conductive structures (5) a sintered, nonconductive paste substantially filling the intermediate spaces between them and both the structures and the interposed pastes are covered by a sintered insulating paste. For concealing the thick-film circuit arrangement from unauthorized access, the following covering construction is carried out:


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