The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 1989

Filed:

Jun. 20, 1988
Applicant:
Inventors:

Clifford G Moore, Arcadia, CA (US);

Herbert P Silverman, Seattle, WA (US);

James R Bredow, La Habra, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
324 / ; 324 / ; 324 / ; 427 10 ;
Abstract

A high sensitivity electroplating or corrosion sensor and method for sensing, employing a relatively strong, self-supporting electrically conductive substrate of high resistivity and a test coating that is electroplated directly onto the substrate. For corrosion monitoring, a test element of the sensor is formed of a thick, high resistivity substrate, such as stainless steel, upon which is electroplated a thin test coating of material to be tested in a corrosive environment. For many applications, the ratio of resistivity of the substrate to resistivity of the test coating is substantially equal to the ratio of thickness of the substrate to thickness of the test coating, which ratio may be about 40 to 1. The sensor may be employed in the monitoring of electroplating by immersing the stainless steel substrate in the electrolytic bath with the object to be plated and measuring the decreasing parallel resistance of the substrate and coating that is plated upon the substrate during a plating of the object. To decrease noise due to currents generated in the plating or corrosion sensor by external currents, the power supply is connected to the sensor substrate to cause equal and opposite current components to flow in the substrate.


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