The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 1989
Filed:
Jun. 15, 1988
Applicant:
Inventors:
William R Evans, Mooresville, NC (US);
Richard F Granitz, Harrisburg, PA (US);
George R Schmedding, Hummelstown, PA (US);
Assignee:
AMP Incorporated, Harrisburg, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439 61 ; 439493 ;
Abstract
A high density interconnection system (2) is configured to provide a reliable interconnection between boards (4, 6). In order to accommodate space restrictions, the circuit boards (4, 6) are placed in a three-dimensional arrangement. The electrical interconnections between boards (4, 6) are provided by electrical connectors (10) rather than by a mother board. The use of electrical connectors (10) enables the signal paths length between the boards to be minimized, thereby allowing for high speed signal transmission.