The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 1989
Filed:
Mar. 24, 1988
Michael J Gawronski, Minneapolis, MN (US);
Steven L Palmquist, Minnetonka, MN (US);
John R Lamberg, Minnetonka, MN (US);
Rebecca A Hart, Plymouth, MN (US);
Honeywell, Inc., Minneapolis, MN (US);
Abstract
A side-launch transition for efficiently joining a coaxial transmission line or coaxial connector to a microstrip transmission line for operation at millimeter wave frequencies. The microstrip transmission line comprises a conductive microstrip pattern on one side of a dielectric substrate and a ground plane on the other. The conductive microstrip pattern includes a rectangular terminal pad area of a predetermined length designed to be approximately equal to the wavelength of the signal being transmitted. This pad area is integrally joined to the microstrip line. A circular iris or aperture, is formed through the ground plane and is in a centered alignment with the terminal pad on the opposite side of the substrate. A small hole extends through the center of the iris and penetrates the substrate as well as the conductive pad area. The outer shield conductor of the coaxial transmission line or the coaxial connector and the dielectric material insulating it from its center conductor are stripped back to expose a predetermined length of center conductor which is then fitted through the small hole from the ground plane side of the substrate and soldered to the conductive pad. The outer shield is likewise soldered or otherwise conductively bonded to the ground plane in the vicinity of the iris aperture.