The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 1989

Filed:

May. 20, 1988
Applicant:
Inventors:

Kazuo Kondo, Aichi, JP;

Asao Morikawa, Aichi, JP;

Hiroshi Iwata, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174 685 ; 252514 ; 264 61 ; 361414 ;
Abstract

A multilayered wiring board comprising a plurality of green sheets of crystallizable glass which have a conductive pattern printed thereon. The green sheets are laminated together and sintered as a unit. The conductive composition used for the conductive pattern mainly comprises Cu or CuO with lesser amounts of MnO.sub.2. According to two embodiments the conductive composition additionally contains (1) Pd and/or Pt or (2) Ag.sub.2 O and TiO.sub.2 or TiH.sub.2. Thereby volume contraction due CuO reduction cancels out volume expansion due to Cu oxidation in the subsequent degreasing.


Find Patent Forward Citations

Quick Actions:

Kondo, Kazuo. (1989). High density multilayer wiring board and the manufacturing thereof (U.S. Patent No. 4837408). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4837408

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…