The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 1989
Filed:
May. 30, 1986
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228179 ; 228-8 ; 228219 ; 228121 ;
Abstract
An airtight packaging apparatus for covering with a cap a multichip module having LSI chips mounted on a ceramic substrate and for sealing the cap and substrate by means of solder includes a receptacle for accommodating the multichip module, valves for supplying gas to the receptacle and exhausting the receptacle, a retainer for holding the cap and adjusting the positional relation with respect to the multichip module, and a heater for heating solder of the junction between the multichip module and the cap. After solder has been heated and melted, the multichip module and the cap are sealed to each other.