The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 1989
Filed:
Dec. 29, 1987
Takayuki Matsukawa, Itami, JP;
Abstract
A semiconductor integrated circuit with a wiring arrangement for high integration density. The arrangement is dispersed on a semiconductor substrate with a first wiring portion formed on the substrate and a second wiring portion formed on the substrate at a location adjacent to one edge of the first wiring portion. The first wiring portion has a groove or a plurality of indentations formed therein, preferably in the vicinity of the edge thereof that is closer to the second wiring portion, for preventing short-circuiting between the first and second wiring portions through parts of the edge of the first wiring portion which have expanded during a heat treatment.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile