The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 1989
Filed:
Jan. 12, 1987
Erich Hodes, Rosbach, DE;
Klaus Goerke, Jugenheim, DE;
Glyco-Metall-Werke Daelen & Loos GmbH, Wiesbaden, DE;
Abstract
A composite structural material particularly intended for frictional and slide elements, consisting of a substrate such as a steel layer with a copper- or tin-containing intermediate layer, a tin- or copper-containing functional layer and, between these last two layers, a diffusion barrier layer protecting against diffusion of tin from the functional layer into the intermediate layer or back to the diffusion barrier layer. The diffusion barrier layer consists of a metallic material having a hexagonal crystal lattice, which material is applied by cathodic sputtering, forming a material structure that is densely packed in vacuo with a space filling by metal ions of above 70%. For the cathodic sputtering, conditions of plasma pressure and substrate temperature can be chosen so that recrystallization occurs simultaneously with the formation of the diffusion barrier layer; this makes it possible to achieve the densest hexagonal packing, with a space filling of up to 74%. Pure titanium is the preferred material for the diffusion barrier layer.