The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 1989
Filed:
Feb. 10, 1988
Mark J Owens, Vernon, CT (US);
Scott S Simpson, Woodstock, CT (US);
Rogers Corporation, Rogers, CT (US);
Abstract
An electrical connector system for electrically interconnecting an integrated circuit chip unit having a plurality of arrays of first contacts arranged in a first pattern of peripheral form with a circuit board having a plurality of planar arrays of second contact pads arranged in a second pattern of peripheral form. The connector system includes a module member adapted to support the integrated circuit chip unit over the pattern of the circuit board, a plurality of rigid contact carrier members, and a plurality of multi-conductor flexible circuit structures extending between respective portions of the first and second peripheral patterns. Each flexible circuit structure has one ends of its conductors on the module member for electrical connection to respective contacts of the integrated circuit chip unit and the other ends of each flexible circuit structure secured to a corresponding contact carrier member with contact pads at those other conductor ends for electrical connection to corresponding contact pads of the circuit board. Each flexible circuit structure is in disposed within the interior of the connector system in an inwardly bowed configuration in which the flexible circuit structures extend inwardly from the peripheral patterns. A unitary clamping device causes movement of each of the contact carrier structures inwardly relative to the peripheral patterns on the circuit board to produce wiping during connecting motion.