The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 1989

Filed:

Sep. 17, 1987
Applicant:
Inventors:

Masahito Imai, Kariya, JP;

Toshitaka Yamada, Nagoya, JP;

Tiaki Mizuno, Toyota, JP;

Hirohito Shioya, Anjo, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P / ;
U.S. Cl.
CPC ...
7351 / ; 7351 / ; 73651 ; 338-5 ;
Abstract

A semiconductor accelerometer includes a package containing damping liquid. A base is fixedly disposed within the package. A semiconductor plate is disposed within the package and is supported on the base. The semiconductor plate has a movable free end and a deformable diaphragm. A semiconductor strain gauge is associated with the diaphragm and deforms in accordance with deformation of the diaphragm. The base has a first surface opposing the semiconductor plate free end. The first surface of the base has a recess for limiting movement of the semiconductor plate free end. The recess extends to and opens at a second surface of the base which differs from the first surface.


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