The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 1989
Filed:
Oct. 05, 1987
Truoc T Tran, Austin, TX (US);
James W Sloan, Westlake Hills, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A lead frame having a central die bond flag for ceramic integrated circuit die packages. The direct connection of the die bond flag to the lead frame via one or more leads permits direct connection of the back side or substrate of an integrated circuit die to a lead while eliminating dedicated supports that provide physical support but no electrical lead function. In a particular embodiment of the invention, a lead frame is provided whereby any of the leads may be chosen to serve as the die bond flag support/lead combination, whereby the rest of the leads are severed from connection with the die bond flag.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile