The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 1989

Filed:

Dec. 16, 1983
Applicant:
Inventors:

Yasuhiro Itoh, Seki, JP;

Katsuji Sakamoto, Gifu, JP;

Hideki Miyabe, Kagamigahara, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
425143 ; 264 405 ; 264 406 ; 425149 ; 4254051 ;
Abstract

An apparatus for molding and curing a resin matrix composite material under pressure and heat by a use of a bag provided in an autoclave for covering the material and applying the pressure to the material. The apparatus comprises a plurality of heater elements arranged along surfaces of the structure to heat the same, a temperature control device for controlling the heating elements, a pressurizing device for adjusting the pressure difference across the bag to thereby pressurize the material, a pressure control device for controlling the pressurized device, temperature detectors for detecting temperatures at predetermined regions on the structures and generating electric signals representing temperatures at respective regions, pressure detectors for detecting pressures within the autoclave and the bag and generating electric signals representing the detected pressures, a regulating device for controlling the temperature control device and the pressure control device to heat and pressurize the structure in accordance with a predetermined condition when the regulating device receives the electric signals from the temperature control device and the pressure control device and for controlling the temperature control device to equalize the temperature at the regions on the material in heating and cooling steps.


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