The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 1989

Filed:

Jan. 27, 1987
Applicant:
Inventors:

Paul J McClure, Colorado Springs, CO (US);

Robert E Jones, Jr, Colorado Springs, CO (US);

Assignee:

INMOS Corporation, Colorado Springs, CO (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437174 ; 437 16 ; 437173 ; 437194 ; 437192 ; 437228 ; 437921 ; 148D / ; 148D / ;
Abstract

A metallic interconnect includes a fuse portion that is readily vaporized upon exposure to the radiant energy of a laser. A layer of optically absorptive material is formed on top of an aluminum based metallic interconnect and together they are formed by a photolithographic and etch technique into a fuse portion. A low energy laser having a Gaussian energy distribution focused on the absorptive layer produces heat in the absorptive layer. The heat is transferred to the underlying aluminum based interconnect. The concentration of energy made possible by the absorptive layer allows the low energy laser to blow the fuse thereby producing an electrical open in the interconnect without damaging surrounding silicon substrate and/or polysilicon structures below or nearby the metal fuse.


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