The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 1989
Filed:
Oct. 05, 1987
Applicant:
Inventor:
Sanehiko Kakihana, San Francisco, CA (US);
Assignee:
Menlo Industries, Inc., Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228123 ;
Abstract
Disclosed is a process for attaching a die to a package, which process utilizes a heat cycle in conjunction with a vacuum in the attachment process.
Kakihana, Sanehiko. (1989). Die attachment process (U.S. Patent No. 4826070). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4826070
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile