Sense amplifier optimized lay-out from dynamic random access memories on

Abstract

A sense amplifier having an optimized structural lay-out for D-RAM on the C-MOS provides the same time lag from nodes of the sense amplifier and does not produce unbalances in the voltages. This allows the sense amplifier to uniformly distribute the parasitic capacitance of the bit lines used for the D-RAM on the C-MOS. The sense amplifier is connected to a memory cell array so that transistors and capacitors are coupled with a plurality of bit lines and word lines situated on the semiconductor substrate. The amplifier has a first semiconductor region which is within an N type well region located on the P type semiconductor substrate to form a first latch circuit. A second semiconductor region which is contiguous to the N type well region is also formed on the semiconductor substrate to form an N-MOS transistor. Lastly, a third semiconductor region, which is contiguous to the N type well region and the second semiconductor region, forms a second latch circuit having an N-MOS transistor. Thus, the sense amplifier is formed at a gate of the N-MOS transistor so that a transfer from the gate of N-MOS transistor through openings in the substrate caused by voltage differences produced by the charge distribution and storage capacitor of bit lines during an active cycle does not have a time lag.