The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 1989

Filed:

Jan. 25, 1988
Applicant:
Inventor:

Jun Fukaya, Shinjuku, JP;

Assignee:

Fujitsu Limited, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
347 74 ; 357 68 ; 357 69 ; 357 70 ; 357 72 ; 357 80 ; 357 81 ;
Abstract

A semiconductor device comprising: a base plate for mounting a semiconductor chip; side walls disposed on the base plate to surround the semiconductor chip; an input lead piece and an output lead piece, both being connected to the semiconductor chip and extending outward from the side walls; and at least one earth lead piece extending outward from the side wall between the positions from where the input and output lead pieces are taken out. The side walls at the positions from where the input and output lead pieces are taken out are made of electrical insulation material. The side wall at the position from where the earth lead piece is taken out is made of metal as one body integral with a bonding terminal extending inward of the side wall and the earth lead piece extending outward of the side wall.


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