The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 1989
Filed:
Apr. 28, 1988
Applicant:
Inventor:
Hirozo Takano, Hyogo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437180 ; 437944 ; 437228 ; 437229 ; 437203 ; 148D / ;
Abstract
An improved method of lift-off processing semiconductor devices including ohmic electrodes, gate electrodes, metal wiring, and the like. The invention provides for the production of an access groove pattern in the surface of the substrate prior to the application of the resist by photolithography and the deposition of metallization. The access groove pattern increases the opportunity for the chemical stripper to dissolve the resist and lift away the unrequired portions of the metallization, thus improving the reliability of the lift-off.