The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 1989
Filed:
Mar. 20, 1987
Applicant:
Inventors:
Tadakatsu Nakajima, Ibaraki, JP;
Wataru Nakayama, Kashiwa, JP;
Shigeo Oohashi, Ibaraki, JP;
Heikichi Kuwabara, Ibaraki, JP;
Takahiro Daikoku, Usiku, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F / ;
U.S. Cl.
CPC ...
165 804 ; 165907 ; 361385 ; 357 82 ;
Abstract
The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is contained in cavities formed in the porous layer, the heat generating element and the heat sink element being held in close contact by the surface tension of the liquid, whereby heat generated by the heat generating element is transferred to the heat sink element.