The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 1989

Filed:

Apr. 07, 1987
Applicant:
Inventors:

Sung G Chu, Wilmington, DE (US);

Harold Jabloner, Wilmington, DE (US);

Brian J Swetlin, Wilmington, DE (US);

Assignee:

Hercules Incorporated, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08G / ; C08K / ;
U.S. Cl.
CPC ...
523423 ; 428209 ; 428901 ; 523445 ; 523458 ; 523466 ; 523468 ; 525113 ; 525389 ; 525396 ; 525415 ; 525423 ; 525438 ; 525468 ; 525504 ; 525523 ; 525525 ; 525526 ; 525906 ; 525 90 ; 525 93 ; 525109 ; 525119 ; 525129 ; 525315 ;
Abstract

Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardner and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.


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