The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 1989

Filed:

Oct. 08, 1986
Applicant:
Inventors:

Yoshimasa Oyama, Nikko, JP;

Masato Asai, Nikko, JP;

Toru Tanigawa, Nikko, JP;

Shigeo Shinozaki, Nikko, JP;

Shoji Shiga, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420470 ; 420473 ; 420476 ; 148433 ;
Abstract

A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.


Find Patent Forward Citations

Oyama, Yoshimasa. (1989). Copper alloy and method of manufacturing the same (U.S. Patent No. 4822560). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4822560

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