The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 1989
Filed:
Nov. 30, 1987
Applicant:
Inventors:
Atsushi Sawaki, Aichi, JP;
Mamoru Ono, Aichi, JP;
Toshio Okazaki, Aichi, JP;
Koji Naruse, Aichi, JP;
Assignee:
Yazaki Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01B / ; H01B / ;
U.S. Cl.
CPC ...
156 48 ; 156 49 ; 156 55 ; 156 56 ; 1562755 ; 264 22 ; 26427214 ;
Abstract
The invention provides an improved method for forming a cover layer over a joint of electrical wires. Portions of insulation layers of wires to be joined are stripped and the bared conductors of the wires assembled in a desired configuration to form a joint. The joint is placed in a transparent mold and the mold is filled with a photosetting resin. Radiation of an appropriate wavelength is then passed through the mold to harden the resin.