The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 1989
Filed:
Dec. 02, 1987
Takuo Tate, Hachioji, JP;
Nippon Filcon Co. Ltd., Tokyo, JP;
Abstract
A multi-layer fabric for paper-making comprising at least two fabric layers A and B, each of which is formed by inter-weaving respective warps and wefts. An upper-most layer A is woven as a plain weave 1/1 except at binding points S1, S3 and is adapted to support a paper-web thereon. A lower layer B is positioned below the upper-most layer A, and formed by warps 3 and wefts 4, 4a, each of which have larger diameters than those of the upper-most layer A. The upper-most layer A and the lower-most layer B are bound by means of a part 1a of the warps 1 of the upper-most layer A being interwoven with a part 4a of the wefts 4 of the lower-most layer, or by means of separate binder threads 5 other than the warps or wefts being interwoven with the upper-most layer A and the lower-most layer B. At the binding points, a warp 1a of the upper-most layer which intersects with a weft 4a of the lower-most layer B or with a binder thread 5 is extended under three successive wefts 2a. A weft 2a of the upper-most layer A at the binding point S1 is extended above three successive warps 1, 1a, 1 of the upper-most layer A.