The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 1989

Filed:

Sep. 30, 1987
Applicant:
Inventor:

Jon D Stine, Elizabethtown, PA (US);

Assignee:

AMP Incorporated, Harrisburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439510 ; 439723 ; 439787 ;
Abstract

A miniature low-profile shunt connector (10) for one or more than one pair of terminal posts (20) of a post array includes a housing member (12) having at least one shunt-receiving cavity (16), and at least one shunt member (14) formed of a continuous length of wire having spring characteristics. The formed wire shunt (14) has a central portion (36) consisting of a pair of leg sections (38) extending rearwardly from a large bight (40) at the front of the cavity (16), and end sections (46) extending forwardly from rear bights (44) joining them to respective leg sections (38). Free ends (48) of the end sections (46) are disposed behind stop surfaces (28) near the front of the cavity (16) to retain the formed wire shunt (14) therewithin. Near the mating face (18) each pair of end and leg sections (46,38) form a constriction at contact sections (50,42) to engage a respective terminal post (20) received therebetween, and the end section (46) is deflected outwardly and acts like a spring arm providing contact normal force against the post. Surfaces of the formed wire shunt (14) which engage the post (20) are formed by wire extrusion and are smooth and free of surface irregularities assuring adhesion of plating material and minimizing post damage.


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