The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1989
Filed:
Jun. 19, 1987
John R Jurgensen, Urbana, OH (US);
Systran Corporation, Dayton, OH (US);
Abstract
A method for curing rubber in a heated mold in which the temperature of the mold is measured after closure and variations in temperature from an optimum cure temperature are used to adjust elapsed cure times which decrement an optimum cure time. The adjustment of elapsed cure time is determined by an algorithm which utilizes the 18.degree. F. (10.degree. C.) doubling rule; that is, that the rate of cure doubles for each increase in temperature of 18.degree. F. (10.degree. C.) and halves for each decrease in temperature of 18.degree. F. (10.degree. C.). Accordingly, the algorithm reduces the cure time remaining at a rate exceeding the actual elapsed time if the temperature of the mold is measured and determined to be above the optimum or set point temperature, and conversely, the cure time remaining is lengthened by reducing the cure time remaining at a rate below the actual elapsed time rate if the measured temperature of the mold is below the set point temperature. When cure time remaining is less than or equal to zero a command is given to open the mold and remove the cured article.