The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 1989

Filed:

Dec. 30, 1983
Applicant:
Inventor:

John P Redmond, Mechanicsburg, PA (US);

Assignee:

AMP Incorporated, Harrisburg, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 80 ;
Abstract

A surface mountable integrated circuit chip package is taught. Briefly stated, a flexible laminate having conductive strips thereon is wrapped around a heat sink. Plastic is molded around the laminate-heat sink piece, with a window left in the center thereof, which coincides with a window in the laminate. An integrated circuit chip is then bonded to the heat sink with wire leads then run from the chip to the conductive strips on the laminate. A potting material is then placed in the window thereby completely encapsulating the integrated circuit chip so as to prevent exposure to environmental or physical damage. This thereby forms a package which is surface mountable to a circuit board through attachment techniques such as the vapor phase soldering.


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