The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 1989

Filed:

Nov. 13, 1987
Applicant:
Inventor:

Lance R Kaufman, Mequon, WI (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; G01R / ; H04R / ;
U.S. Cl.
CPC ...
3073031 ; 3074821 ; 307308 ; 307314 ; 357 25 ; 357 27 ; 357 70 ; 357 75 ; 174 32 ; 174 36 ; 361400 ; 374184 ; 323359 ; 320 39 ;
Abstract

In a circuit assembly (36) having a semiconductor chip such as a MOSFET (12) mounted on a drain terminal lead frame (6) on a ceramic substrate (4), a combined source and gate return reference jumper wire (40) is connected between a current sense lead frame (52) and a combined gate return reference and current sense lead frame (38). The jumper wire has a first middle portion (42) connected to the source pad (14) of the MOSFET chip (12), and has a second middle portion 58 connected to the source terminal lead frame (8). Direct gate return referencing is provided, minimizing inductance in the gate return which is otherwise present when the gate return current path shares a portion of the source terminal current path. Direct current sensing is also provided, and the IR drop is sensed across the section of the wire jumper between the noted first and second middle portions (42and 58), without the need of an auxiliary resistor in series with the source terminal. A gold wire (62 ) is bonded to an aluminum jumper wire (40) directly at the MOSFET source pad (14) at the noted first middle portion (42) of the wire, to provide a thermocouple thereat for direct junction temperature sensing.


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