The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 1989

Filed:

Jul. 16, 1987
Applicant:
Inventors:

Ching-Fa Yeh, Kanagawa, JP;

Yasunao Misawa, Kanagawa, JP;

Yuji Yatsuda, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437057 ; 357 42 ; 437 34 ; 437 46 ; 437 56 ; 437 59 ;
Abstract

A method of manufacturing a semiconductor device having a high voltage CMOS unit for an ordinary logic operation and a MOS unit which are provided in a single semiconductor substrate of a first conduction type. The method includes the steps of performing an element region making process for making a well of a second conduction type in the substrate, performing a process for providing field-effect transistors having channels of mutually different conduction types in the substrate and the well, and then performing a process for providing electrode wiring layers. Finally, a process is performed for providing a first impurity region having a particular conduction type and serving as a channel stopper of the CMOS unit and a second impurity region having the conduction type of the first impurity region and serving as an offset low-resistance layer of the high voltage MOS unit.


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