The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1989
Filed:
Jul. 21, 1987
Charles J Taylor, Catonsville, MD (US);
Julius Grossman, Randallstown, MD (US);
Jacqueline Fischer, Silver Spring, MD (US);
Howard A Smith, Chevy Chase, MD (US);
Martin C Peckerar, Silver Spring, MD (US);
Milton L Rebbert, Elkridge, MD (US);
The United States of America as represented by the Secretary of the Navy, Washington, DC (US);
Abstract
A method of fabricating a free-standing wire mesh grid pattern having a sth, flat surface is disclosed. A thermal oxide is selectively applied to front and back sides of a silicon substrate. A central portion of the oxide on the back side is removed. A resist layer is applied onto the oxide on the front side of the substrate. A resist mesh pattern with a border encompassing that resist mesh pattern is lithographically developed on the resist layer. Chrome and gold layers are sequentially deposited onto the border and into the resist mesh pattern to create a wire mesh pattern within the resist mesh pattern. The resist layer, including the developed resist mesh pattern, is removed to expose the wire mesh pattern from the front side of the substrate. A nickel layer is deposited over the gold layer to develop a wider wire mesh pattern. A second gold layer is then deposited over the nickel layer to form a wire mesh grid pattern composed of chrome, gold, nickel and gold layers. Central portions of the substrate and the oxide on the front side of the substrate are removed to expose the wire mesh grid pattern from the back side of the substrate. Finally, the chrome layer is removed to produce the desired free-standing wire mesh grid pattern supported by the encompassing metal-clad border.