The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 1989

Filed:

Oct. 16, 1987
Applicant:
Inventors:

Karl-Heinz Grunthaler, Usingen, DE;

Dieter Langbein, Bad Homburg, DE;

Fehmi Nilmen, Kriftel/Ts., DE;

Heinrich Winter, Eschborn, DE;

Assignee:

Battelle-Institut e.V., Frankfurt am Main, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G22F / ;
U.S. Cl.
CPC ...
75247 ; 75 56 ; 75 76 ; 148 132 ; 148411 ; 419 33 ; 419 66 ; 419 67 ; 420469 ; 420495 ; 420590 ;
Abstract

A process for producing a dispersion hardened copper alloy includes admixing to a copper melt from 0.3 to 15 weight % of molybdenum to provide a mixture which is a melt; superheating the mixture to a temperature ranging from about 200.degree. C. to about 1000.degree. C. above the melting point of coper to provide a superheated melt; and subjecting the superheated melt to very rapid solidification at a cooling rate ranging from 104.degree. to 106.degree. C./sec. The above process produces dipsersion hardened copper alloy comprising copper and from 1 to 15 weight % of molybdenum which is present in the dispersion hardened copper alloy as particles having a diameter of less than 0.1 .mu.m embedded in the copper matrix. Such dispersion hardened copper alloys are useful for providing electrical conductors which are subjected to elevated temperatures, such as for providing spot welding electrodes, particularly for welding of zinc-galvanized sheet metal. Such alloys do not become brittle when heated up to around about 500.degree. C. or even up to around about 800.degree. C.


Find Patent Forward Citations

Grunthaler, Karl-Heinz. (1989). Dispersion hardened copper alloys and production process therefore (U.S. Patent No. 4818283). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4818283

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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