The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1989
Filed:
Jun. 15, 1987
Homer G Hargrove, Maitland, FL (US);
Jay L Kratz, Cherry Hill, NJ (US);
Westinghouse Electric Corp., Pittsburgh, PA (US);
Abstract
This is a process which provides the first essentially continuous high tin flow soldering method for attaching copper-based fins to non-copper-based tubing. This invention avoids sludge buildup in the reservoir and generally avoids lead carbonate formation when the heat produced having a braze-like joint with eta phase layers exchanger is in service. In addition, a novel structure is adjacent to copper-containing surfaces. The invention utilizes an essentially lead-free, high tin solder cascade onto a preferably cool tube, genrally with a limited time of contact between the liquid solder and the tube, and with a combination air quench and wipe to remove excess solder and solidify the remaining solder. Thus a braze-like joint is achieved having better heat conduction and closer thermal expansion match. This finned heat exchanger tubing is generally useful for liquid to gas-type heat exchangers.