The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1989
Filed:
Mar. 28, 1988
Eliezer Wiener-Avnear, Carlsbad, CA (US);
Ronald L Williams, San Marcos, CA (US);
Hughes Aircraft Company, Los Angeles, CA (US);
Abstract
A substrate contact structure which includes a plurality of contact pads formed on a surface of the substrate and located for receiving a predetermined integrated circuit chip or die having conductive bonding bumps corresponding to and respectively associated with the plurality of contact pads. Each of the contact pads includes a plurality of bonding sites, wherein the pattern of bonding sites is substantially identical for each of the contact pads. Each bonding site has corresponding bonding sites on the other contact pads which cooperatively form sets of bonding sites, each of which is a mirror image of the conductive bonding bumps on the predetermined integrated circuit chip. Methods of producing substrates suitable for removal and replacement of bump bonded integrated circuit chips, as well as methods of repair of such structures are also disclosed.