The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1989
Filed:
Sep. 08, 1987
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
228103 ; 228105 ; 228123 ; 228-9 ; 228 447 ; 228 491 ; 156 64 ; 29593 ; 29834 ; 437209 ; 219 851 ; 219 8516 ;
Abstract
A method for bonding a semiconductor laser element, wherein a laser chip (4) is mounted on a stem (1) and a driving electric power is supplied to the laser chip through members for mounting the laser chip so that the laser chip emits a laser light, then the direction of the laser light is examined, and position of the laser chip is adjusted, in a manner that the direction of the laser light becomes within a predetermined range, and subsequently the laser chip is bonded on the pedestal (2) upon detection of entering the direction in the range, by flowing a large current through in the pedestal (2).