The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 1989
Filed:
Apr. 02, 1986
Applicant:
Inventors:
Gyozo Toda, Hino, JP;
Takashi Kuroki, Yokohama, JP;
Shousaku Ishihara, Kamakura, JP;
Naoya Kanda, Yokohama, JP;
Tsuyoshi Fujita, Yokohama, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; C04B / ; C04B / ;
U.S. Cl.
CPC ...
29830 ; 29846 ; 29848 ; 29852 ; 4273762 ; 501119 ; 501128 ;
Abstract
A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite crystals and a non-crystalline binder composed of SiO.sub.2, Al.sub.2 O.sub.3, and MgO, is provided.