The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 1989
Filed:
Oct. 28, 1987
Applicant:
Inventor:
Richard C Landis, Orlando, FL (US);
Assignee:
ITT Gallium Arsenide Technology Center A Division of ITT Corporation, Roanoke, VA (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361401 ; 174 / ; 174 36 ; 174 51 ; 174 521 ;
Abstract
A method and structure are disclosed for mounting and connecting an electic device such as an integrated circuit to a circuit board. The board has a plurality of embedded shielded conductors for interconnecting the integrated circuit to other devices on the board. In order to limit the capacitance and inductance of the connection, the integrated circuit is mass bonded directly to the conductors and to their coaxial shields.
Landis, Richard. (1989). Low impedance interconnect method and structure for high frequency ic (U.S. Patent No. 4816967). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4816967
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile