The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 1989
Filed:
May. 30, 1986
P Michael Uthe, Redwood City, CA (US);
Paul S Bamburak, Trenton, NJ (US);
Crestek, Inc., Belmont, CA (US);
Abstract
A bond quality monitor and method for monitoring and analyzing the relative quality of bonding operations performed by ultrasonic bonding machines is disclosed. The bond quality monitor (40) includes an analog bond monitoring circuit (42) and a digital microcomputer (44). The bond monitoring circuit, which is placed in series between an ultrasonic signal generator (26) and its corresponding ultrasonic transducer (18), monitors the transducer power signal generated by the ultrasonic signal generator and performs a series of analog computations based on the logarithm of the impedance of the transducer in order to create a measure of bond quality. The microcomputer controls the operation of the bond monitoring circuit and performs comparisons to determine bond quality relative to previously monitored good quality bonds.