The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 1989
Filed:
Jul. 13, 1988
Hiroyuki Sagawa, Takatsuki, JP;
Hirofumi Koga, Kyoto, JP;
Shunichi Agatahama, Mishima, JP;
Hideyuki Okumura, Takatsuki, JP;
Kazushige Matsuoka, Kyoto, JP;
Ryuichi Sato, Kyoto, JP;
Omron Tateisi Electronics Co., Tokyo, JP;
Abstract
In this mounting structure and method for a surface mounted type electronic component, the component has at least one terminal which protrudes from its bottom surface and which terminates in a foot portion for being soldered to a printed circuit board. Also, a projection extends from this bottom surface of the electronic component for a distance somewhat less than the amounty by which the terminal projects from it. This projection is provisionally secured by adhesive to the printed circuit board with the foot portion of the terminal overlaying that circuit portion to which it is to be soldered, and then subsequently this terminal foot portion is soldered to this circuit portion. Thereby, during the soldering process, there is no risk of the terminal foot portion becoming displaced from the circuit portion and thus badly soldered thereto, because of the locating action of the adhered projection. The projection may extend from a central portion of the bottom surface of the component, or may be provided in plurality as extending from central portions of edges of said bottom surface. And the end of the projection may be roughened.