The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 1989
Filed:
Jun. 02, 1987
Hiroshi Okuaki, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A printed circuit device including semiconductor IC chips on the surface of a printed circuit board made of insulating material. The printed circuit board includes on the surface thereof semiconductor mounting regions and conductive layers. The semiconductor IC chips are respectively fixedly mounted on the semiconductor element mounting regions disposed on the printed circuit board. Thin metal wires interconnect electrodes of the IC chips with the conductive layers. A sealing cover plate having a plurality of recesses formed therein is fixedly mounted onto the surface of the printed circuit board with adhesive for hermetically sealing each of the IC chips and electric wires with a respective one of the recesses in the cover plate. The cover plate can comprise a composite of a thermoplastic resin material layer and a metal layer, such as aluminum or an aluminum alloy.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile