The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 1989
Filed:
May. 13, 1987
Richard D Anderson, Maple Grove, MN (US);
Micro Component Technology, Inc., St. Paul, MN (US);
Abstract
A shuttle-actuated singulation apparatus (10) for use in handling integrated circuit devices (16). A shuttle (39), acting to isolate or singulate an individual integrated circuit device (16) for transfer to a test apparatus, is included. A shuttle assembly (30) is carried by a splined shaft (34) for rotational movement of shuttle (39) carried thereby. The assembly (30), additionally, is moved laterally by means of a drive cable (36). Rotation of a shuttle barrel (32) and associated upward pivoting of shuttle projectiles (42) carried by barrel (32) effects engagement of a bell crank (70) which, in turn, engages a belt drive mount (82) carrying a drive belt (80). The drive belt (80), thereafter, is engaged with an integrated circuit device (16) to impel the device (16) out of a track (12) in which it is received. The engagement of the shuttle projectiles (42) with a shoulder (72) of the bell crank (70) pivots the belt drive mount (82), thereby overcoming belt drive mount biasing spring (90) which normally retains the belt drive mount (82) in its original position. A stop (60) associate with each track (12) is also engaged by upward rotation of the shuttle projectiles (42). Engagement of the stop (60) by projectiles (42) overcomes stop biasing spring (62) to allow the belt drive (80) to push an integrated circuit device (16) out of the track (12) and into the shuttle assembly (30). The shuttle assembly (30) is then moved laterally to a position in alignment with a chute (18) and shuttle (39) rotated to a second position where the integrated circuit device (16) is expelled from the shuttle by means of a spring (48) into the common test site chute (18).