The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 1989
Filed:
Aug. 26, 1987
Applicant:
Inventors:
Lloyd E Hackman, Worthington, OH (US);
James Dickson, Stirling, NJ (US);
David L Dunlap, Gahanna, OH (US);
Mark E Handshey, Columbus, OH (US);
Assignee:
Ribbon Technology Corporation, Gahanna, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D / ;
U.S. Cl.
CPC ...
164463 ; 164423 ;
Abstract
A heat extracting substrate is moved along a melt front formed at the edge of the surface of a molten material so that a layer of molten material is deposited on the substrate, cooled and removed from the substrate to form ribbon, filaments, fiber of film directly from the molten material. The edge may be formed by providing an upper edge upon a portion of the wall of a receptacle lower than the top of the receptacle. The molten material may be overflowed over this relatively horizontal edge and against the moving substrate surface.