The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 1989

Filed:

Jan. 13, 1988
Applicant:
Inventor:

Dan Massopust, Menomonie, WI (US);

Assignee:

Cray Research, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; H01R / ;
U.S. Cl.
CPC ...
29830 ; 174 / ; 439875 ;
Abstract

A connector frame for use in the connection of electrical circuit assemblies having pins integrally connected therewith. The connector frame is a body of electrically non-conductive, thermally conductive material having one or more apertures bored through the body, said apertures being through-plated with an electrically-conductive material having a lower melting point than any of the surrounding materials. Said body also includes at least one separate aperture in which is disposed an electrically-conductive, heat-generating wire, said wire having the capacity to generate sufficient heat to melt the electrically-conductive material disposed in the apertures to form a strong electrical and mechanical bond between the pins of the electrical circuit assemblies.


Find Patent Forward Citations

Massopust, Dan. (1989). High density disposable printed circuit inter-board connector (U.S. Patent No. 4813128). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4813128

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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