The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 1989
Filed:
Dec. 14, 1987
Applicant:
Inventors:
Wolfgang Kleeberg, Erlangen, DE;
Heinz Hacker, Nuremberg, DE;
Jurgen Huber, Erlangen, DE;
Dieter Wilhelm, Forchheim, DE;
Heinz K Laupenmuhlen, Hemhofen, DE;
Assignee:
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08K / ;
U.S. Cl.
CPC ...
523443 ; 523466 ; 528118 ; 528367 ;
Abstract
Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.